| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition having preferable stability and proper heat resistance, electrical characteristics, mechanical characteristics or the like, even when used at a low thermosetting temperature. <P>SOLUTION: The positive photosensitive resin composition contains 100 parts by mass of hydroxypolyamide, having a repeating unit expressed by general Formula (1), 0.1 to 30 parts by mass of a specified ester compound, and 1 to 100 parts by mass of a photosensitive diazoquinone compound. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
