发明名称 WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board excellent in transmission characteristics of a high frequency signal and capable of being surely connected with an external electric circuit without any inconvenience. <P>SOLUTION: The wiring board comprises an insulating substrate 1 in which a plurality of wiring conductors 2 are formed, a plurality of connection pads 3 formed on the principal surface of the insulating substrate 1, and a plurality of though conductors 4 or electrically connecting the wiring conductors 2 and the connection pads 3. A high frequency signal wiring conductor 2a among the wiring conductors 2 connected with the plurality of through conductors 4, respectively, is made not to overlap, as viewed in a plane, the connection pad 3a to which the high frequency signal wiring conductor 2a is electrically connected, and one end of the high frequency wiring conductor 2a is electrically connected with the end of the connection pad 3a via the through conductor 4a. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006128301(A) 申请公布日期 2006.05.18
申请号 JP20040312651 申请日期 2004.10.27
申请人 KYOCERA CORP 发明人 TOMITA MINORU
分类号 H01L23/12;H05K3/46 主分类号 H01L23/12
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