| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable package for storing semiconductor elements for preventing a metal lid body from being deformed to the recess side of an insulating substrate and preventing the metal lid body from coming into contact with a bonding wire in a recess when joining and sealing the metal lid body to the insulating substrate, and to provide a semiconductor device. SOLUTION: The semiconductor device 9 comprises the insulating substrate 1 having the recess 1a for storing the semiconductor element 3 on the upper surface; a wiring conductor 2 led from the inside to the outside of the recess 1a of the insulating substrate 1; and the lid body 5 made of a shape memory alloy mounted to the upper surface of the insulating substrate 1 so that the recess 1a is blocked. In the lid body 5, the outer-periphery section of the lower surface is mounted to the periphery of the recess 1a on the upper surface of the insulating substrate 1. COPYRIGHT: (C)2006,JPO&NCIPI |
