| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputter film deposition system capable of preventing dust or the like from being intruded into a film-deposited substrate during the film deposition, and obtaining the film-deposited substrate having excellent appearance characteristic. SOLUTION: A film thickness correction tool of the sputter film deposition system is constituted so that the surface shape of all parts to be exposed to film deposition particles, charged particles and ions facing an inner target surface of a part of the film thickness correction tool is set so that the angle of incidence with respect to the perpendicular direction from the target surface is≤20°while maintaining the original film thickness correction function. COPYRIGHT: (C)2006,JPO&NCIPI
|
