发明名称 Process for producing ptc element/metal lead element connecting structure and ptc element for use in the process
摘要 The present invention provides a novel method for electrical connection between a polymer PTC device and a metal lead element to thereby prevent the problems of the connection by caulking or soldering. For this purpose, the present invention provides a process for producing a connection structure by laser welding, said connection structure having (A) a PTC device ( 10 ) including (i) a laminar polymer PTC element ( 12 ) and (ii) a metal foil electrode ( 14 ) disposed on a main surface of the laminar polymer PTC element ( 12 ), and (B) a metal lead element ( 20 ) electrically connected to the metal foil electrode. The metal foil electrode ( 14 ) has at least two metal layers, one of which, the X-th layer, has laser beam absorption a % that is the lowest among the metal layers of the metal foil electrode ( 14 ). The X-th layer is present between a first metal layer ( 18 ) of the metal foil electrode-and the laminar polymer PTC element ( 12 ). First metal layer ( 18 ) is located farthest from the laminar polymer PTC element ( 12 ) and has a laser beam absorption of b %, where b>a.
申请公布号 US2006102692(A1) 申请公布日期 2006.05.18
申请号 US20050526705 申请日期 2005.11.14
申请人 NAKAGAWA ATSUSHI;TANAKA ARATA;IIMURA MIKIO 发明人 NAKAGAWA ATSUSHI;TANAKA ARATA;IIMURA MIKIO
分类号 A47J36/02;H01C1/14;H01C1/144 主分类号 A47J36/02
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