| 摘要 |
Provided is a flexible printed circuit including a circuit layer with a desired circuit formed thereon, a base layer supporting the circuit layer, a conductive metal layer positioned on at least one side of the base layer, and an insulation film interposed between the base layer and the conductive metal layer. A hole is formed on the circuit layer and the base layer through punching work, and the insulation film covers one end of the hole.
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