发明名称 REPLICATION OF A HIGH-DENSITY RELIEF STRUCTURE
摘要 The invention relates to a method for manufacturing a reverse mold (2, 4) for replicating a high-density relief structure (1), to such a reverse mold (2, 4) and to a method for replicating of such a high-density relief structure (1). To provide an improved and reliable method for the best possible replication of a high-density relief structure (1) a method for manufacturing a reverse mold (2, 4) for replicating a high-density relief structure (1) is proposed comprising the steps of: applying a curable polymer to a surface of said high-density relief structure (1) having surface shape information to be replicated, thus forming a layer (2) of curable polymer on said surface of said high-density relief structure (1), curing of said polymer to form a reverse mold (2, 4), and separating said reverse mold (2, 4) from said high-density relief structure (1).
申请公布号 WO2006027732(A3) 申请公布日期 2006.05.18
申请号 WO2005IB52880 申请日期 2005.09.02
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V.;MEINDERS, ERWIN, R. 发明人 MEINDERS, ERWIN, R.
分类号 G11B7/26 主分类号 G11B7/26
代理机构 代理人
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