| 摘要 |
This invention relates to semi-conductor sealing device, which comprises one baseboard, one first chip, one non-conductive glue, one second chip and multiple supportive sphere, wherein, the first chip has relative upper and down surfaces fixed on the baseboard; the non-conductive glue is set on the top surface of the first chip; the second chip has relative top and down surfaces, wherein, the said down surface is fixed on the top surface of the first chip through non-conductive glue with adherent area between the non-conductive glue and the second chip is larger than the down surface area; the multiple supportive sphere located on the non-conductive glue to support the second chip. |
