发明名称 BONDING DEVICE
摘要 A bonding apparatus 10 including an X and Y motor parts 20 and 50 , which have substantially the same construction, and a moving table 60 , which can be moved in the XY plane by these motor parts. The X motor part 20 and Y motor part 50 are connected to the moving table 60 by joint mechanisms 42 and 52 that are rotatable. In the X and Y motor parts 20 and 50 , the movable coils 30 of the movable elements 24 are shaft-supported by shaft-supporting mechanisms 36 so that these coils are rotatable about the Z axis, and the shaft-supporting mechanisms 36 are guided so as to be movable linearly in the X and Y axial directions respectively by a guide mechanism formed with guide rails 38 and linear guides 37.
申请公布号 KR20060047805(A) 申请公布日期 2006.05.18
申请号 KR20050039663 申请日期 2005.05.12
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 KAKUTANI OSAMU;MAEDA TORU
分类号 H01L21/60;B23K5/00;B23K20/00;B23K37/00;B23K37/02;H01L21/52 主分类号 H01L21/60
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