| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting element mounting structure which can realize the improvement in heat dissipation with stable reliability, and to provide a method of manufacturing the light emitting element mounting structure. <P>SOLUTION: In the light emitting element mounting structure, an n-type semiconductor 3 is formed to cover the whole surface on a sapphire substrate 2, an n-type semiconductor 4 and a p-type semiconductor 5 are formed on the top surface of the n-type semiconductor 3, and further an LED 1 of the configuration that a p-type electrode 6 is formed on the top surface of the p-type semiconductor 5 is packaged in a substrate 7. A conductor layer 22a is formed by coating and curing metal nano particle paste to the n-type electrode 4, and the conductor layer 22a is connected to the first terminal 9a of the substrate 7 at the packaging time by positioning and bonding the p-type semiconductor 5 to the second terminal 9b. Consequently, the LED 1 can be packaged in the substrate 7 by a thin bonding part in a large bonding area as much as possible, and the improvement in the heat dissipation can be realized with stable reliability. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
