| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which connection reliability is enhanced by enhancing connection strength of a semiconductor chip and wiring while lowering the resistance, and to provide its manufacturing process. SOLUTION: The semiconductor device comprises a semiconductor chip 2 and wiring 6 for connection with the terminal 4 of the semiconductor chip 2. In the semiconductor chip 2, uppermost layer 4c of the terminal 4 is formed of a metal layer having a thickness of 0.1-1.0μm, the wiring 6 is formed of a sintered body of fine metal particles, and at least a part of the wiring 6 is formed in the uppermost layer 4c of the terminal 4 under solid state diffusion state at the joint between the wiring 6 and the terminal 4. COPYRIGHT: (C)2006,JPO&NCIPI
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