摘要 |
A modular connector assembly includes a modular frame having a first holes, second holes, and third holes formed at evenly spaced intervals. A plurality of modular interconnect components, fixable within the modular frame, have a back surface projection formed thereon. Each modular interconnect includes a contact housing made of electrically insulating material, an exterior of the contact housing comprising first and second side surfaces, a back surface, and a top surface. Contact signal pins are fixed within and electrically insulated from the contact housing.
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