| 摘要 |
A semiconductor chip is wired with a bonding wire on a conductor pattern formed on a substrate, the bonding wire is connected to a bonding position at a midpoint of a distributed constant line formed by the conductor pattern and divides the line into a first inductor and a second inductor, and matching of handled frequencies or an output load is performed. With this configuration, power amplifier modules for amplifying given frequency bands can be manufactured using a common substrate.
|
