| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition giving cured films having excellent film physical properties, to provide a semiconductor device, and to provide a display element. <P>SOLUTION: A resin composition is characterized by comprising an alkali-soluble resin (A) and a cyclic iminoether structure-having compound (B). The resin composition further containing a compound (C) generating oxygen with light. The positive type photosensitive resin composition, wherein the alkali-soluble resin (A) contains one or more of a polybenzoxazole structure, a polybenzoxazole precursor structure, a polyimide structure, a polyimide precursor structure and a polyamic acid ester structure. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
