发明名称 PHOTOSENSITIVE INSULATING PASTE AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT COMPONENT USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive insulating paste, having a low dielectric constant and high insulation, making it possible to form an insulating layer having fine through holes. <P>SOLUTION: The photosensitive insulating paste comprises at least a silica powder, a glass powder and a photosensitive organic component, wherein the glass powder contains a low melting glass, having softening point of 350-550&deg;C and a high melting glass having softening point of 600-900&deg;C, wherein a relative dielectric constant of the high melting glass is &le;8. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006126716(A) 申请公布日期 2006.05.18
申请号 JP20040318104 申请日期 2004.11.01
申请人 TORAY IND INC 发明人 KUSANO KAZUTAKA;FUJIWARA HIROKO;IGUCHI YUICHIRO
分类号 G03F7/004;C03C8/22;G03F7/027 主分类号 G03F7/004
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