发明名称 |
VERTICAL BOAT FOR HEAT TREATMENT AND HEAT TREATING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a vertical boat for heat treatment capable of effectively preventing a slip from being generated in a wafer and the like in the heat treatment even in the case of heat treatment at an extremely high temperature of 1,200°C or more, and capable of manufacturing the wafer having the surface layer with high productivity and quality, and to provide a method for the heat treatment. SOLUTION: A vertical boat 8 for heat treatment carries-in or carries-out at least a plurality of wafer-state bodies to be treated by supporting them with a gap in an up-and-down direction by a support column having support surfaces. The underside of wafer-state the body to be treated is supported by a plurality of the support surfaces 4 formed at the support column. The flatness of a face formed of the plurality of support faces that contact with the same body to be treated is not more than 0.03 mm, and the parallelism thereof is not more than 0.07 mm. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006128316(A) |
申请公布日期 |
2006.05.18 |
申请号 |
JP20040312893 |
申请日期 |
2004.10.27 |
申请人 |
SHIN ETSU HANDOTAI CO LTD;MIMASU SEMICONDUCTOR INDUSTRY CO LTD |
发明人 |
AIHARA TAKESHI;TAKAHASHI SHUJI;UEHARA YOSHIYUKI |
分类号 |
H01L21/324;H01L21/22;H01L21/31;H01L21/683 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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