| 摘要 |
PROBLEM TO BE SOLVED: To check the state of an opening formed in a semiconductor substrate without observing the cross-section. SOLUTION: In the semiconductor apparatus where an opening is formed from the back of a semiconductor substrate 1 such that a pad electrode 3 formed thereon is exposed and a wiring layer 10 is formed for the pad electrode 3 through the opening, an opening 6b for monitoring the formation state of the opening is formed on a scribe line. COPYRIGHT: (C)2006,JPO&NCIPI
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