| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device capable of realizing a low voltage and high luminance by preventing peeling or the like of an electrode by obtaining excellent adhesion in-between an electrode material, even when a semiconductor laser is subjected to face-down mounting, and also, even when an insulating film and a protection film or the like are interposed in regions other than a region where a semiconductor layer and the electrode are ohmic-connected. SOLUTION: The semiconductor device has the electrically connected electrode on the semiconductor layer. A dielectric film and an adhesion film composed of a degenerated semiconductor are laminated in that order in a part of a region between the semiconductor layer and the electrode. The adhesion film is interposed so as to contact with the electrode. COPYRIGHT: (C)2006,JPO&NCIPI
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