| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming method of a semiconductor film capable of stably forming the semiconductor film with a uniform film thickness by suppressing the evaporation of a composition with photopolymerization in the case of forming the semiconductor film, and preventing contamination in a photo mask and a chamber caused by the evaporated composition, and to provide a manufacturing method of a semiconductor element substrate, an electrooptic apparatus provided with the semiconductor element substrate obtained by the method, an electronic device, and a semiconductor film forming apparatus. SOLUTION: The forming method of the semiconductor film forms the semiconductor film on one side of a substrate 10 with optical transparency, and includes steps of forming a liquidous film 20a on the one side of the substrate 10 by supplying a liquidous material containing the composition with photopolymerization on the one side; obtaining a polymerization film by polymerizing the composition to the liquidous film 20a by irradiating light 40 to the liquidous film 20a from the other side of the substrate 10 in a state that the one side formed with the liquidous film 20a is covered by an enclosed package 43; and obtaining the semiconductor film by heating the polymerization film. COPYRIGHT: (C)2006,JPO&NCIPI
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