| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiple wiring board for reducing the possibility of a plated layer being peeled, the plated layer being deposited on the surface of an exposed wiring conductor of each wiring board region when dividing a mother board. SOLUTION: The multiple wiring board comprises the mother board 101 where a plurality of wiring board regions 102 are formed at the center longitudinally and laterally with a margin region 103 formed in an external peripheral part; a divided groove 106 formed along a boundary between adjacent wiring board regions 102 on one surface 110 of the mother board 101; wiring conductors 104 formed in the plurality of wiring board regions 102; a through-hole 107 formed striding adjacent wiring board regions 102 sandwiching the divided groove 106 therebetween, where the inner size of an opening on one surface 110 side of the mother board 101 is larger than that of an opening on the other face 111 side of the mother board 101; and a through conductor 105 formed in the internal surface of the through hole 107 and electrically connected to the wiring conductor 104. COPYRIGHT: (C)2006,JPO&NCIPI
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