| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device by which the quality of a semiconductor device can be improved. SOLUTION: After the qualities of chips mounted on semiconductor wafers are discriminated in a P-inspection 1 step, the presence of defective chips is discriminated on the all semiconductor wafers on which the qualities of the chips are discriminated in the next AUF 1 step. In the AUF 1 step, the presence of the defective chips is discriminated by providing a plurality of discriminating modes (for example, longitudinally and laterally dividing discriminating mode, concentric circular dividing discriminating mode, outer periphery discriminating mode, radially dividing discriminating mode, block detecting discriminating mode, straight line detecting discriminating mode, and straight line summing-up discriminating mode) and, on the semiconductor wafer on which the existence of a defective chip is discriminated, the chips around the defective chip are treated as defective chips in which defective potential exists. COPYRIGHT: (C)2006,JPO&NCIPI
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