发明名称 Method for data collection during manufacturing processes
摘要 The present invention discloses a new data collection method employed by a middle layer between the host and the equipment, which improves the speed and consistency of data collection. The middle layer incorporated with the proposed data collection method functions as a data format converter as well as a data processor/classifier, which helps to filter and format messages before delivering data to the host or equipment. The proposed data collection method enables the middle layer to perform local reply, local data sampling, and group data polling, thus relieving processing resources of both the equipment and the host. This allows implementation of APC on older wafer fabrication processes using old equipment.
申请公布号 US2006106921(A1) 申请公布日期 2006.05.18
申请号 US20040988805 申请日期 2004.11.15
申请人 TECH SEMICONDUCTOR SINGAPORE PTE. LTD. 发明人 SIM BOON H.;ZHOU PING
分类号 G06F15/177;G06F15/16;G06F15/173 主分类号 G06F15/177
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