FACING-TARGET TYPE SPUTTERING APPARATUS, AND FACING-TARGET TYPE SPUTTERING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a facing-target type sputtering apparatus having an improved film-forming speed, and to provide a facing-target type sputtering method. SOLUTION: The facing-target type sputtering method comprises: applying an electric power to a pair of targets 1 and 2 arranged in a vacuum vessel 6, to discharge them; controlling a flow rate of a reactive gas so that the targets can emit a predetermined level of light; and forming a reactive film by sputtering the targets. COPYRIGHT: (C)2006,JPO&NCIPI