| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for avoiding a fine crack from forming in a plated metallic film. SOLUTION: This plating method for preparing a multilayer ceramic substrate comprising a ceramic workpiece 6 containing a Zn component, a conductive part 7 formed on the surface of it and a Ni-P film 8 formed on the conductive portion 7 by electroless nickel plating includes eluting the Zn component by treating an article to be plated with a solution of a complexing agent, before subjecting the article to an electroless nickel plating step. Thereby, a content of the Zn element in the Ni-P film 8 is controlled to 0.6 wt.% or less. By the eluting treatment for Zn, the content of the Zn element in the surface layer 6'(A) at least 5μm or less deep from the surface 6" of the ceramic workpiece 6 is controlled so as to be less than that in a region other than the surface layer 6', and gradually decreases from the inner part of the ceramic workpiece 6 toward the surface 6". COPYRIGHT: (C)2006,JPO&NCIPI
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