| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide-imide resin composition having excellent low warpage, flexibility, adhesion to a sealing material, solvent resistance and chemical resistance, soluble in a nitrogen-free polar solvent, exhibiting low-temperature curability, and also having excellent heat resistance, electrical characteristics, moistureproof properties, operability and economical efficiency; and to provide a film-forming material having the above excellent characteristics and obtained by using the composition. SOLUTION: The polyamide-imide resin composition contains (A) a polyamide-imide resin and (B) an amine-type epoxy resin. The amine-type epoxy resin (B) may have three or more epoxy groups in one molecule. The content of the amine-type epoxy resin (B) is 1-50 pts.wt. based on 100 pts.wt. polyamide-imide resin (A). The film-forming material comprises the film formed by using the polyamide-imide resin composition. COPYRIGHT: (C)2006,JPO&NCIPI
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