Laminated module for circuit board for electronic circuit with stack of several layers, i.e. at least one conductive layer and at least one electrically insulating material

摘要

Laminated module (1) for circuit board for electronic circuit comprises stack of several layers, i.e. at least one conductive layer (3) and at least one electrically insulating layer (2). There is RFID transponder (4), preferably located on outer side of laminated stack.Alternatively RFID transponder may be embedded in laminated stack, e.g. between several layers, or in single layer. RFID transponder may include aerial system for transmitting and receiving radio signals, control elements for signal processing and memory (iGS) for electronic information. Independent claims are included for semi-finished product of circuit board, circuit board and method for manufacturing laminated module.