| 发明名称 |
ELASTIC WAVE DEVICE AND PACKAGE SUBSTRATE |
| 摘要 |
A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads. |
| 申请公布号 |
KR20060047542(A) |
申请公布日期 |
2006.05.18 |
| 申请号 |
KR20050035116 |
申请日期 |
2005.04.27 |
| 申请人 |
FUJITSU MEDIA DEVICES LIMITED;FUJITSU LIMITED |
发明人 |
MATSUDA TAKASHI;WARASHINA SUGURU;UEDA MASANORI;KAWACHI OSAMU;KANEDA YASUFUMI |
| 分类号 |
H01L41/09;H03H9/25;H01L23/02;H01L23/06;H01L23/48;H01L23/52;H01L29/40;H03H3/08;H03H9/00;H03H9/10;H03H9/145 |
主分类号 |
H01L41/09 |
| 代理机构 |
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代理人 |
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| 主权项 |
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