| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polyimide composition which prevents cohesive failure of a film and has improved adhesive strength between a copper foil pattern and a cover lay and improved adhesive strength between a substrate to be protected and a polyimide resist. <P>SOLUTION: The polyimide composition is obtained by dehydrative ring closure of a polyamic acid having a molecular weight distribution (Mw/Mn) of at least 1.3 and at most 5.0, an Mw (weight-average molecular weight) within the range from 10,000 to 1,000,000 and a water content of less than 5%, and gives intrinsic viscosity of at least 0.5 when it is dissolved in sulfuric acid and an imidation ratio of at least 90% when it reaches 250°C in a baking step. A film composed of the polyimide composition is also provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
