| 摘要 |
PROBLEM TO BE SOLVED: To improve the stress reducing effect at a bonding part of conductor lines having a different line width. SOLUTION: Inner leads RI and outer leads RO are formed on a circuit board, and they are connected to each other via the bonding part KB wherein three or more bent portions P1, P2, and P3 are formed. COPYRIGHT: (C)2006,JPO&NCIPI |
