ULTRASONIC PROBE, ULTRASONIC IMAGING APPARATUS AND ULTRASONIC PROBE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an ultrasonic probe connecting a piezoelectric plate and an FPC (Flexible Printed Circuit) board without causing deterioration of acoustic characteristics of the ultrasonic probe and to provide an ultrasonic imaging apparatus and an ultrasonic probe manufacturing method. SOLUTION: The ultrasonic probe connects the FPC board 30 to a piezoelectric plate block 70 via micropins 60 in the side of the piezoelectric plate block 70, so that the FPC board 30 and the piezoelectric plate 10 are electrically connected without disposing the FPC board 30 between a matching layer 72 or a packing material 71 and the piezoelectric block 70 to prevent the deterioration of the acoustic characteristics of the ultrasonic probe 101 and improve the image quality of the ultrasonic imaging apparatus. COPYRIGHT: (C)2006,JPO&NCIPI