ELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

摘要

Disclosed is an electronic component (1), especially a high frequency power module (2), comprising a hollow housing (3) with a housing frame (4), plastic walls (5), and a metallic housing bottom (9) with at least one chip island (10) and at least one semiconductor chip (11) which is disposed on said chip island (10). The plastic walls (5) are made of a thermosetting material while being provided with surfaces (36) that are connected to surfaces (37) of the metallic housing bottom (9) via a soldered joint.