发明名称 |
VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE VORRICHTUNG DAZU UND DARIN VERWENDETE PORÖSE FOLIE |
摘要 |
A manufacturing method of a circuit board comprises the steps of: (a) feeding a printing stage having a porous member comprising a porous plate and a porous sheet, the porous sheet is composed of 90 wt % to 98 wt % of cellulose; (b) placing a plate for the circuit board having a pierced hole above the porous member; and (c) filling a conductive material in the pierced hole from an upper side of the plate for circuit board by sucking the porous member at a prescribed vacuum pressure from a back of the porous member. |
申请公布号 |
DE69930719(D1) |
申请公布日期 |
2006.05.18 |
申请号 |
DE1999630719 |
申请日期 |
1999.10.07 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SEGAWA, SHIGETOSHI;BABA, YASUYUKI;ISHIKAWA, KATSUYOSHI;IHARA, KAZUHIKO |
分类号 |
H05K3/40;B41F15/20;D21H11/04;H05K3/12 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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