发明名称 |
GEDRUCKTE SCHALTUNGSPLATTE UND VERFAHREN ZU DEREN HERSTELLUNG |
摘要 |
A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and that of another opening are equalized, the quantity of resin which is filled in each opening or is equalized throughout a printed wiring board and the quantity of resin overflowing from each opening or when resin is filled in each opening or is uniformed is provided. According to such a printed wiring board, a reliable printed wiring board wherein secure connection is enabled without causing disconnection can be realized when a circuit pattern provided on an interlayer insulating board formed on the printed wiring board and a conductor pad are connected by arranging an opening existing around a conductor pad so that it is not overlapped with the conductor pad and substantially equalizing the quantity of resin which is filled in an opening around a conductor pad and that of resin which is filled in another opening. |
申请公布号 |
DE69636010(D1) |
申请公布日期 |
2006.05.18 |
申请号 |
DE1996636010 |
申请日期 |
1996.12.19 |
申请人 |
IBIDEN CO.,LTD. |
发明人 |
MORI, YOJI;KAWAMURA, YOICHIRO |
分类号 |
H05K1/02;H05K1/11;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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