发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE AND ELECTRONIC COMPONENT MOUNTING METHOD
摘要 <p>Recognition of a position of a printed board is performed both before and after a chip component is mounted on the printed board. When a difference between the positions recognized before and after that is out of a predetermined allowable range, the printed board is treated as a defective. A CPU (61) compares positions of a positioning mark provided on a printed board recognized both before and after a chip component is mounted on the printed board, the positions being taken an image by a board recognition camera (70) and recognized by a recognition processing device (68). The CPU (61) checks whether or not a difference between the positions is within a predetermined range stored in a RAM (62), that is, within a range from - 0.100 mm to + 0.100 mm, in both X and Y directions. When judging that the difference is within the range, the CPU (61) controls an electronic component mounting apparatus to stop because of an error.</p>
申请公布号 KR20060048344(A) 申请公布日期 2006.05.18
申请号 KR20050050657 申请日期 2005.06.14
申请人 HITACHI HIGH-TECH INSTRUMENT CO., LTD. 发明人 TAKEMURA IKUO;OKAMOTO MANABU;IIDA SIGERU;OONISHI SEIJI;ASAI JUN
分类号 H05K13/04;H05K13/00;H05K13/08 主分类号 H05K13/04
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