发明名称 METHOD OF MANUFACTURING ELECTRONIC CIRCUIT AND ELECTRONIC CIRCUIT
摘要 According to an embodiment of the present invention, a method of producing an electronic circuit comprises printing first metal-containing resin particles which consist of at least a thermosetting resin and fine metal particles and second metal-containing resin particles which consist of at least a thermoplastic resin and fine metal particles by electrophotography to form a first base pattern which consists of the first metal-containing resin particles and a second base pattern which consists of the second metal-containing resin particles on a substrate; forming a first metal conductor layer on the first and second base patterns; forming a second metal conductor layer on the first metal conductor layer by electrolytic plating by supplying electric current to the first metal conductor layer; and removing the second base pattern and the first and second metal conductor layers which are formed on the second base pattern.
申请公布号 KR20060045616(A) 申请公布日期 2006.05.17
申请号 KR20050030303 申请日期 2005.04.12
申请人 KABUSHIKI KAISHA TOSHIBA;TOSHIBA TEC KABUSHIKI KAISHA 发明人 AOKI HIDEO;YAMAGUCHI NAOKO;TAKUBO CHIAKI;YAMAUCHI TOSHIAKI;IMAMIYA KOJI;HASHIZUME HIROSHI
分类号 H05K3/18;H01L21/48;H01L23/495;H05K1/09;H05K3/12;H05K3/24 主分类号 H05K3/18
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