发明名称 |
METHOD OF MANUFACTURING ELECTRONIC CIRCUIT AND ELECTRONIC CIRCUIT |
摘要 |
According to an embodiment of the present invention, a method of producing an electronic circuit comprises printing first metal-containing resin particles which consist of at least a thermosetting resin and fine metal particles and second metal-containing resin particles which consist of at least a thermoplastic resin and fine metal particles by electrophotography to form a first base pattern which consists of the first metal-containing resin particles and a second base pattern which consists of the second metal-containing resin particles on a substrate; forming a first metal conductor layer on the first and second base patterns; forming a second metal conductor layer on the first metal conductor layer by electrolytic plating by supplying electric current to the first metal conductor layer; and removing the second base pattern and the first and second metal conductor layers which are formed on the second base pattern. |
申请公布号 |
KR20060045616(A) |
申请公布日期 |
2006.05.17 |
申请号 |
KR20050030303 |
申请日期 |
2005.04.12 |
申请人 |
KABUSHIKI KAISHA TOSHIBA;TOSHIBA TEC KABUSHIKI KAISHA |
发明人 |
AOKI HIDEO;YAMAGUCHI NAOKO;TAKUBO CHIAKI;YAMAUCHI TOSHIAKI;IMAMIYA KOJI;HASHIZUME HIROSHI |
分类号 |
H05K3/18;H01L21/48;H01L23/495;H05K1/09;H05K3/12;H05K3/24 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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