发明名称 Cooling device
摘要 Cooler comprises base plate (1) for inserting onto component to be cooled, to which is coupled heat conductive core (2). Fan (8) and guide (3) with flow guide baffles (4), coupled to core complete cooling structure. Core extends in direction of base plate in extension of fan axis (10).Baffles point radially away from core and are helically coiled round core, which is typically of copper or aluminium. Preferably further heat conducting element (6) is provided, orthogonally to core, over which baffles are also coupled to core. INDEPENDENT CLAIM is included for application of cooler.
申请公布号 EP1628343(A3) 申请公布日期 2006.05.17
申请号 EP20050013038 申请日期 2005.06.16
申请人 FUJITSU SIEMENS COMPUTERS GMBH 发明人 RIEBEL, MICHAEL
分类号 H01L23/467 主分类号 H01L23/467
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