| 摘要 |
The invention relates to a method of manufacturing a highly moisture-sensitive electronic device elements containing microelectronic elements (2) in a hermetically sealed encapsulation enclosure (8), comprising the steps of: providing a substrate (1); providing a sealing member (6) which may form together with the substrate (1) a hermetically sealed encapsulation enclosure (8); placing micro-electronic elements (2) including at least one highly moisture-sensitive micro-electronic element (5) on the substrate (1); placing a desiccant material (9) on at least a portion of internal surfaces of the encapsulation enclosure (8); hermetically sealing the electronic device element by bonding the substrate (1) to the sealing member (6) such that the micro-electronic elements (2) are placed in a water-tight encapsulation enclosure (8); wherein the desiccant material (9) is activated by exposing the desiccant material (9) to microwave radiation of a wavelength/frequency that is absorbed by water molecules; |
