发明名称 PRESSURE CONTACT SPRING FOR A CONTACT ARRANGEMENT IN A POWER SEMICONDUCTOR MODULE
摘要 The pressure contact spring ( 3 ) according to the invention comprises two contacting regions ( 31, 32 ) for contacting metallized contact pads ( 1, 2 ), one contacting region comprising a contact tip ( 31 ). Arranged between the contacting regions is a compressing region ( 33 ). The contact tip is rounded with an outer radius. The rounded contact tip penetrates only little into the metallization of the contact pad even under high spring force.
申请公布号 EP1656719(A1) 申请公布日期 2006.05.17
申请号 EP20030818255 申请日期 2003.08.22
申请人 ABB SCHWEIZ AG 发明人 HERR, EGON;ASSAL, JEROME
分类号 H01L23/48;H01R13/24;H01R13/33;(IPC1-7):H01R13/33 主分类号 H01L23/48
代理机构 代理人
主权项
地址