发明名称
摘要 PROBLEM TO BE SOLVED: To provide a wire saw processing method excellent in practicality by further improving. SOLUTION: In this wire saw processing device, a wire 7 is moved, and the wire 7 is pressed onto a material 1 to be machined while the material is rotated cutting the material. The revolving speed of the material 1 to be machined during the period of time from a starting time to a time when shallow grooves are formed over the outer circumferential surface of the material 1 to be machined, is made lower than its revolution speed later on. By this constitution, the wire 7 can be stably processed without shaking over the processed surface of the material when the processing is started. As the moving direction of the wire 7 is reversed, the rotational direction of the material 1 to be machine is reversed. Before the material 1 to be machined is cut off at its center portion, the rotation of the material 1 to be machined is suspended, and the moving wire 7 is pressed onto the material 1 to be machined in a state of the material 1 to be machine suspended in rotation to cut off the material 1 to be machined at its center portion.
申请公布号 JP3775044(B2) 申请公布日期 2006.05.17
申请号 JP19980083725 申请日期 1998.03.30
申请人 发明人
分类号 B24B27/06;B28D5/04 主分类号 B24B27/06
代理机构 代理人
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