发明名称 Sheet for optical semiconductor element encapsulation and process for producing optical semiconductor device with the sheet
摘要 The present invention provides a sheet (1) for optical-semiconductor-element encapsulation, which comprises: an outermost resin layer A (2) that is to be brought into contact with one or more optical semiconductor elements (6); a light-diffusing layer (3) formed on the layer A (2) and containing light-diffusing particles; and a resin layer B (4) formed on the light-diffusing layer (3) and having a lower refractive index than that of the layer A (2). Also disclosed is a process for producing an optical semiconductor device using the sheet (1).
申请公布号 EP1657756(A2) 申请公布日期 2006.05.17
申请号 EP20050024939 申请日期 2005.11.15
申请人 NITTO DENKO CORPORATION 发明人 HARADA, NORIAKI;HOTTA, YUJI;SUEHIRO, ICHIRO;SADAYORI, NAOKI
分类号 B29C43/18;B29C43/20;H01L33/32;H01L33/54 主分类号 B29C43/18
代理机构 代理人
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