| 发明名称 |
METHOD FOR DETACHING A SEMICONDUCTOR CHIP FROM A FOIL AND APPARATUS FOR MOUNTING SEMICONDUCTOR CHIPS |
| 摘要 |
Vacuum is applied to a groove (12) in the support area of a chip ejector (6). A wafer table is moved vertically relative to a stripping edge (18) of a ramp (16) in the ejector, so as to pull the foil over the stripping edge, during which the chip detaches from the foil and falls on foil portion over the support area. The chip is then picked out. - An INDEPENDENT CLAIM is also included for semiconductor chip mounting apparatus. |
| 申请公布号 |
KR20060045639(A) |
申请公布日期 |
2006.05.17 |
| 申请号 |
KR20050030505 |
申请日期 |
2005.04.12 |
| 申请人 |
UNAXIS INTERNATIONAL TRADING LTD. |
发明人 |
MEDDING JONATHAN;LUSTENBERGER MARTINA;NIEDERHAUSER MARCEL;SCHNETZLER DANIEL;STALDER ROLAND |
| 分类号 |
H01L21/50;H01L21/52;H01L21/00;H01L21/68;H01L21/78 |
主分类号 |
H01L21/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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