发明名称 A bendable heat spreader with wire mesh microstructure
摘要 A bendable heat spreader comprises a hollow metallic housing including an upper cover 12 and a lower cover 14, the upper and lower covers 12, 14 being bonded together along their perimeters 12a, 14b defining a cavity; a capillary structure in a form of metallic meshes 18 bonded to the inner surfaces of the upper and lower covers 12, 14; a plurality of reinforcing members 20 disposed in the cavity and bonded between the inner surfaces of the upper and lower covers 12, 14; and a working fluid received in the cavity. The bonded surfaces between the metallic meshes 18 and the inner surfaces of the metallic housing, the upper cover 12 and the lower cover 14, and the reinforcing members 20 and the inner surfaces of the metallic housing are all diffusion-bonded interfaces. A method of fabricating the heat spreader is also disclosed.
申请公布号 GB2420223(A) 申请公布日期 2006.05.17
申请号 GB20050011538 申请日期 2005.06.07
申请人 TAIWAN MICROLOOPS CORP 发明人 KUO-YING LEE;CHIEN-WEN CHIU;CHIEN-HUNG LIN;CHERNG-YUH SU
分类号 H01L23/427;F28D15/02;F28D15/04 主分类号 H01L23/427
代理机构 代理人
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