ETCHING REMOVING METHOD AND ETCHING SOLUTION IN MANUFACTURING PRINT WIRING SUBSTRATE USING SEMI-ADDITIVE PROCESS,申请号KR20050050229-传众专利搜索

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发明名称	ETCHING REMOVING METHOD AND ETCHING SOLUTION IN MANUFACTURING PRINT WIRING SUBSTRATE USING SEMI-ADDITIVE PROCESS
摘要
申请公布号	KR20060046430(A)	申请公布日期	2006.05.17
申请号	KR20050050229	申请日期	2005.06.13
申请人	MITSUBISHI GAS CHEMICAL COMPANY, INC.	发明人	HOSOMI AKIRA
分类号	C23F1/18	主分类号	C23F1/18
代理机构		代理人
主权项
地址

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