Machine for controlling encapsulating semiconductors with plastics

摘要

The resin molding equipment comprises: a work piece feeding section (A); a work piece measuring section (B) measuring thickness of a semiconductor chip (10b) mounted on a work piece (10); a resin supplying section (C) supplying liquid resin to the work piece; a resin molding section (D) having a molding die for molding the work piece with the liquid resin; a product measuring section (E) measuring thickness of a resin molded part of the molded product; a product accommodating section (F); and a control section (G) for controlling the sections. The control section (G) includes means for adjusting an amount of the liquid resin, which is supplied to the work piece (10) by the resin supplying section (C), on the basis of the thickness measured by the work piece measuring section (B).