ELECTRONIC COMPONENT, MOUNTED STRUCTURE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC DEVICE

摘要

The invention seeks to provide an electronic component with excellent redundancy. An electronic component 121 electrically connected to a counter substrate through a pad 24 on an active surface, characterized in that a resin bump 12 on the active surface and an electrically conductive film 20 on the resin bump 12 constitute a bump electrode 10, and that a plurality of bump electrodes 10a and 10b are electrically connected to the one pad 24.