发明名称 |
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MOUNTING BODY, ELECTRONIC COMPONENT MOUNTING BODY, AND ELECTRO-OPTICAL DEVICE |
摘要 |
A method of manufacturing an electronic component mounting body is used for mounting an IC chip having a bumps as an external mounting terminal on a base material made of thermoplastic resin, comprising: a bump burying step of burying the bumps into the base material by heating and pressing the IC chip toward the base material to expose a portion of the bumps to a base material surface on the opposite side of the IC chip, and a step of forming a conductor conductively connected to the bump by arranging conductive material on the base material surface to which the portion of the bumps are exposed. |
申请公布号 |
KR20060045552(A) |
申请公布日期 |
2006.05.17 |
申请号 |
KR20050028820 |
申请日期 |
2005.04.07 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
KURASAWA MUNENORI;SAITO ATSUSHI |
分类号 |
H01L21/60;B23K31/02;G02F1/13;G03F7/20;G03F9/00;H01L21/56;H01L23/12;H01L23/31;H01L23/485;H01L23/544;H05K1/18;H05K3/00;H05K3/32;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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