| 发明名称 |
SEMICONDUCTOR CHIP RESIN-SEALING METHOD AND ADHESIVE TAPE FOR PASTING LEAD FRAMES OR THE LIKE |
| 摘要 |
A pressure-sensitive adhesive tape (2) is adhered to a leadframe (1). A semiconductor chip (3) is bonded to the leadframe (A) having the pressure-sensitive adhesive tape and encapsulated with a resin in a mold (4). The pressure-sensitive adhesive tape (2) is stripped after the encapsulating. The resin encapsulating efficiency is improved, and breakage of bonding parts is prevented with certainty. <IMAGE> |
| 申请公布号 |
EP1094512(A4) |
申请公布日期 |
2006.05.17 |
| 申请号 |
EP19990961462 |
申请日期 |
1999.12.28 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
FURUTA, YOSHIHISA;WATANABE, YOSHINORI |
| 分类号 |
H01L21/56;C09J183/04;H01L21/68;H01L23/28;H01L23/50 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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