| 摘要 |
Provided is a stack type semiconductor package. The semiconductor package includes a first substrate, a first semiconductor chip, a second substrate, at least one second semiconductor chip and at least one third substrate. The first substrate has external connection terminals mounted on a first surface and a plurality of lands on a second surface that is an opposite side of the first surface. The first semiconductor chip is mounted on the second surface of the first substrate. The second substrate is attached at its first surface to the first semiconductor chip and includes plural outer lands in an outer perimeter of the second surface that is the opposite side of the first surface, a window penetrating between the first and second surface, inner lands around the window of the second surface. The second semiconductor chip is mounted on the second surface of the second substrate. At least one third substrate is attached to the first surface of the second semiconductor chip and includes plural inner lands in the outer perimeter of the second surface that is the opposite side of the first surface, and the window penetrating between the first and second surface, and the inner lands around the window of the second surface. The first and second semiconductor chips have a center pad structure.
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