发明名称 |
HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
A method of manufacturing a hybrid integrated circuit device of the present invention includes the steps of preparing a lead frame which constituted by units each having a plurality of leads, and fixing a circuit substrate on each unit of the lead frame by fixing pads which are formed on the surface of the circuit substrate to the leads, where a space between a first pad which is formed at an end edge of the circuit substrate and a second pad which is adjacent to the first pad is set narrower than a space between the pads themselves. |
申请公布号 |
KR20060044533(A) |
申请公布日期 |
2006.05.16 |
申请号 |
KR20050023541 |
申请日期 |
2005.03.22 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
IIMURA JUNICHI;KOIKE YASUHIRO;IZUTANI SOICHI |
分类号 |
H01L21/60;H01L23/50;H01L21/48;H01L23/48;H01L23/495;H01L25/16;H05K1/05;H05K1/11;H05K3/00;H05K3/28;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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