| 摘要 |
A semiconductor device includes a metal block, a semiconductor element on the metal block, an insulation layer on the metal block opposite the semiconductor element, a bonding material between the semiconductor element and the metal block, and a resin package configured to seal the semiconductor element and the metal block while uncovering the insulating layer. The bonding material has a higher heat conduction than the insulation layer, and the insulation layer has a higher heat conduction than the resin package. |
